منابع مشابه
Reliability challenges in 3D IC packaging technology
0026-2714/$ see front matter 2010 Elsevier Ltd. A doi:10.1016/j.microrel.2010.09.031 E-mail address: [email protected] At the moment, a major paradigm change, from 2D IC to 3D IC, is occurring in microelectronic industry. Joule heating is serious in 3D IC, and vertical interconnect is the critical element to be developed. Also reliability concerns will be extremely important. For example, in order ...
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Mechanical stress management is a challenge for leading edge semiconductor technology, both in terms of achieving the desired device performance through strain engineering, and in terms of managing chip-package interactions. Starting from the 45 nm CMOS technology node, the mechanical stress has comparable impact on layout-driven variability of intra-channel charge carrier mobility and threshol...
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This article presents key research needs in three-dimensional integrated circuit (3D IC) architectural floorplanning. Architectural floorplaning is done at a very early stage of 3D IC design process, where the goal is to quickly evaluate architectural designs described in register-transfer level (RTL) in terms of power, performance, and reliability. This evaluation is then fed back to architect...
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Small, high-speed, and multi-functional computers and other electronic devices have been enabled by high integration technologies that have come to reality by the miniaturization through the LSI process scaling which uses a very fine pattern. However, an upper limit in the progress of such miniaturization has come into sight. The miniaturization will be technologically limited due to the increa...
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ژورنال
عنوان ژورنال: Journal of the Korean Welding and Joining Society
سال: 2009
ISSN: 1225-6153
DOI: 10.5781/kwjs.2009.27.3.004